| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization and thickness reduction while preventing deterioration in image quality of an imaging apparatus in a range where the device is affected by wave motion due to microfabrication of pixels, in a camera module employing a semiconductor imaging device. SOLUTION: The imaging apparatus is provided with the semiconductor imaging device having a plurality of photodiodes and a color filter; and an image pickup optical system for guiding a light from a subject to the semiconductor imaging device. The diameters 40, 41 of openings of the photodiodes of the semiconductor imaging device are each decided based on the wavelength of a light passing through a color filter provided on the incident surface side of each of the photodiodes. COPYRIGHT: (C)2007,JPO&INPIT
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