发明名称 Dry etching process and method for manufacturing magnetic memory device
摘要 Provision of a process capable of preferably etching particularly PtMn used for a pin layer of an MRAM is an object: a dry etching method for performing dry etching on a layer including platinum and/or manganese by using pulse plasma and a production method of an MRAM, wherein the dry etching method is applied to processing of the pin layer. The MRAM is configured to have a memory portion comprising a magnetic memory element composed of tunnel magnetoresistive effect element formed by stacking a magnetic fixed layer having a fixed magnetization direction, a tunnel barrier layer and a magnetic layer capable of changing the magnetization direction.
申请公布号 US2007026681(A1) 申请公布日期 2007.02.01
申请号 US20060568960 申请日期 2006.02.22
申请人 SONY CORPORATION 发明人 SHIRAIWA TOSHIAKI;TATSUMI TETSUYA;SAMUKAWA SEIJI
分类号 H01L21/302;H01L21/3065;H01L21/3213;H01L21/8246;H01L27/105;H01L27/22;H01L43/08;H01L43/12 主分类号 H01L21/302
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