| 摘要 |
A device for testing a plurality of integrated semiconductor circuits on wafers is disclosed. The device includes a support device for taking in and temperature control, particularly heating or cooling, of the wafer, a measuring board with electronic circuit units for a function check of the integrated semiconductor circuits disposed on the wafers, a test head, connected to the measuring board, with contact needles, the head which creates an electrical contact between the measuring board and the integrated semiconductor circuits, and at least one nozzle for introducing a purge gas onto the wafer surface, whereby the device is provided without a sealing enclosure and that the support device, measuring board, wafer, test head, and nozzle are exposed to the gas mixture of the atmosphere.
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