| 摘要 |
MEMS devices ( 100 ) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device ( 100 ) comprises a substrate ( 106 ) having a surface, an electrode ( 128 ) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism ( 204 ) disposed on the electrode second portion, the stress-release mechanism ( 204 ) including a first slot ( 208 ) integrally formed in the electrode. In another exemplary embodiment, the substrate ( 106 ) includes an anchor ( 134, 136 ) and the stress-release mechanism 222 is formed adjacent the anchor ( 134, 136 ).
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