METHOD FOR FABRICATING ORGANIC TRANSISTOR BY USING RIGIFLEX MOLD AND ORGANIC TRANSISTOR STRUCTURE THEREOF

摘要

A method for fabricating an organic transistor using a regiflex mold is provided to remarkably improve charge mobility and a current density of an organic transistor by interposing a charge injection layer between an organic semiconductor and a metal electrode such that the charge injection layer makes charges injected smoothly. A gate(204), an insulation layer(206) and an organic semiconductor(208) are sequentially formed on a substrate(202). A regiflex mold has a pattern surface composed of an embossed part and an intagliated part, including an electrode material and a charge injection layer which are sequentially stacked on the pattern surface. After the pattern surface of the regiflex mold is arranged on a target position of the organic semiconductor, the pattern surface is pressed and comes in contact with the organic semiconductor. The regiflex mold is taken away to selectively leave the organic semiconductor material and the metal material stacked in the embossed part on the substrate so that a charge injection layer and a metal electrode made of thin films are formed on a part of the upper part of the organic semiconductor and on the lateral surface of the organic semiconductor. The charge injection layer can be an organic semiconductor or an organic conductor having an energy level between the work function of the metal electrode and the energy level of the organic semiconductor.