发明名称 SUCTION NOZZLE MECHANISM FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To obtain a suction nozzle mechanism capable of easily changing the pressing force acting on an electronic component upon taking out and mounting thereof. <P>SOLUTION: In the suction nozzle mechanism for the electronic component, two compression springs consisting of a compression coil spring 10 having a small spring constant k1 and a free length L1, and a compression coil spring 12 having a large spring constant k2 and a free length L2 smaller than L1, are incorporated so that the compression coil spring 10 is received in a compressed state and the compression coil spring 12 has play and their length Ls upon receiving satisfies L2<Ls<L1. While the compression amount increases from 0 to Ls-L2, the pressing force according to the biasing force of only the compression coil spring 10 having the small spring constant k1 can be applied on the electronic component by the nozzle 1. When the compression amount becomes larger than Ls-L2 after the play has disappeared, a larger pressing force according to the sum of biasing forces of the compression coil spring 10 having the small spring constant k1 and the compression coil spring 12 having the large spring constant k2 can be applied on the electronic component by the nozzle 1. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007027408(A) 申请公布日期 2007.02.01
申请号 JP20050207362 申请日期 2005.07.15
申请人 SONY CORP 发明人 KOZUKA TAKEAKI
分类号 H05K13/04;B25J15/06 主分类号 H05K13/04
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