| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit, and an integrated circuit manufacturing method, wherein integration of interconnection air cavity is controlled for improved reliability. SOLUTION: The invention relates to an improved integrated circuit and an integrated circuit manufacturing method, in which an air cavity, being highly controlled, is introduced in high speed copper interconnection, based on the introduction of polymer material to the side wall of a via and an interconnection line in an interconnection stack. The method includes controlled formation of air cavity, resulting in improved signal propagation performance at a semiconductor interconnection. COPYRIGHT: (C)2007,JPO&INPIT
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