| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to secure sufficiently the reliability of connection by flip chip mounting, and also to avoid causing complication of manufacturing equipment composition etc. in the semiconductor device of flip chip mounting. SOLUTION: The manufacturing method of a semiconductor device is constituted by the flip chip mounting of semiconductor chips 1, 5, 6. As for a bump 3 formed at least in one side among connection terminals 1a, 2a, 5a, 6a by the flip chip mounting, it comprises a wash process for washing by using plasma, and a connection process for carrying out the connection among connection terminals 1a, 2a, 5a, 6a by heating fusion of the solder bump 3 after being washed by the wash process. Further, in the wash process, the wash using plasma is made to carry out in the mixed gas atmosphere of inactive gas and reducing gas. COPYRIGHT: (C)2007,JPO&INPIT |
