发明名称 INTEGRATED CIRCUIT MEMORY ARRAY CONFIGURATION INCLUDING DECODING COMPATIBILITY WITH PARTIAL IMPLEMENTATION OF MULTIPLE MEMORY LAYERS
摘要 An integrated circuit having a three-dimensional memory array provides for a given number of memory planes (FIG. 15), but may be fabricated instead to include a lesser number of memory planes by omitting the masks and processing steps associated with the omitted memory planes, without changing any of the other fabrication mask for the other memory planes or for the remainder of the device, and without requiring routing or other configuration changes to the read or read/write path for the array. Control circuit for selectively enabling certain layer selector circuits is configurable (FIG. 33), and the layer selector circuits are suitably arranged , to couple a respective array line on an implemented memory layer to each respective I/O bus line irrespective of the number of implemented memory planes.
申请公布号 WO2006105453(A3) 申请公布日期 2007.02.01
申请号 WO2006US12106 申请日期 2006.03.31
申请人 SANDISK 3D LLC;FASOLI, LUCA, G.;SCHEUERLEIN, ROY, E. 发明人 FASOLI, LUCA, G.;SCHEUERLEIN, ROY, E.
分类号 G11C15/02;G11C5/06;G11C8/00 主分类号 G11C15/02
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