| 摘要 |
Semiconductor manufacturing equipment is provided to prevent the deviation of a wafer from a blade of a wafer transfer robot under a wafer transfer process by forming a protruded portion on the blade of the wafer transfer robot. Semiconductor manufacturing equipment includes a plurality of loadlock chambers, a plurality of process chambers, a transfer chamber and a wafer transfer robot. The plurality of loadlock chambers(110) are used for storing cassettes with a plurality of wafers. Each process chamber(130) includes a chuck for supporting the wafer. The transfer chamber is used for connecting the process chambers with the loadlock chambers. The transfer chamber is selectively opened or closed by using a slit valve. The wafer transfer robot is installed at a center portion of the transfer chamber in order to transfer the wafer between the loadlock chamber and the process chamber. The wafer transfer robot includes a blade(154) with a protruded portion(156), wherein the protruded portion is used for preventing the deviation of the wafer.
|
