| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for generating mask substrate information which is effective to solve problems of decrease in production yield caused by degradation in the flatness of a mask substrate due to chucking the mask substrate on a mask stage of a wafer exposure apparatus. <P>SOLUTION: The method for generating mask substrate information includes a step (S1) of acquiring a first information relating to a surface shape of a principle surface of a mask substrate by a measuring device after a mask pattern is formed, and a step (S3) of generating a second information relating to the flatness of the principal surface by simulation when the mask substrate is set on an exposure apparatus based on the first information and information relating to the structure of a mask chuck of the exposure apparatus. <P>COPYRIGHT: (C)2007,JPO&INPIT |
