| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin-packaged structure and a manufacturing method thereof whereby the deterioration of the characteristic of a ferroelectric capacitor is suppressed with respect to an ultra-thin FeRAM semiconductor chip subjected to a miniaturization/high integration. <P>SOLUTION: In the manufacturing method of a thin-packaged structure, a sealing resin 115 having the percentage content of its filler which falls within the scope of 90-93 wt.% is so used as to mold a semiconductor chip 111, and as to create the packaged structure. <P>COPYRIGHT: (C)2007,JPO&INPIT |
