| 摘要 |
PROBLEM TO BE SOLVED: To prevent the adsorption of LMCS (low molecule siloxane) to a wafer, and to remove the LMCS adsorbed on the wafer. SOLUTION: (1) A sealing material used in a clean room in which a semiconductor element is manufactured, is a fluorine type sealing material. (2) A silicon sealing material is used for the sealing material, and the surface of the sealing material exposed toward the inside of the clean room, is covered with a material which has electric insulation, mechanical stability and deterioration resistance, and is excellent in machinability and adhesiveness. (3) After the LMCS material generated in the atmosphere in which the LMCS generating process is performed, is subjected to a particle-forming process under high-energy states, processes other than this process are performed in an atmosphere, which is isolated from the atmosphere in which the LMCS generating process is performed. (4) A chemical filter using an activated carbon in an outside air suction port into a device for manufacturing the semiconductor element is prepared. (5) A reserve buffer room in which inert gas is filled, is prepared in the device for manufacturing the semiconductor element, and a member for the semiconductor element contaminated with the LMCS in the room, is heat-treated. COPYRIGHT: (C)2007,JPO&INPIT
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