| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating repair method and apparatus wherein the apparatus can be removed without imparting a heat amount of a heat resistance limit to components to reuse repair components with a simplified configuration. SOLUTION: The apparatus comprises a hot air blasting outlet 25; a hot air passage 24; a spring 19a deformed by heating; and a board holding part 18. A solder joint part 14 is melted with hot air 22 and the spring 19a is deformed and elongated by feeding hot air 22 to the hot air passage. Hereby, a substrate holding part 18 is lifted to separate first and second electronic circuit boards 11, 12. COPYRIGHT: (C)2007,JPO&INPIT
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