| 摘要 |
PROBLEM TO BE SOLVED: To provide a Co-based alloy excellent in erosion resistance to lead-free solder, particularly molten Sn-Ag-based lead-free solder, and to provide a lead-free-soldering device member made from the Co-based alloy. SOLUTION: The Co-based alloy comprises 20.0-35.0% Cr, 0.1-25.0% Fe, 0.01-1.20% C, 0.5-2.0% Mn, 0.1-2.0% Si, further one or more groups selected among (a) 1.0-24.0% Ni, (b) one or two elements of 0.01-0.15% La and 0.01-0.15% Ce and (c) 0.001-0.05% Mg, as needed, and the balance Co with unavoidable impurities. The lead-free-soldering device member is made from the Co-based alloy. COPYRIGHT: (C)2007,JPO&INPIT
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