| 摘要 |
PROBLEM TO BE SOLVED: To provide space efficiency of a processing part in regard to a liquid-cooled electronic device. SOLUTION: The liquid-cooled electronic device is installed on a free access floor face F laid on a floor base part at a suitable height, and it is composed such that a gas-liquid heat exchange part 2 is built in a panel body composing the free access floor face F. COPYRIGHT: (C)2007,JPO&INPIT
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