METHOD AND APPARATUS FOR EVALUATING A COMPONENT PICK ACTION IN AN ELECTRONICS ASSEMBLY MACHINE

摘要

An electronics assembly apparatus (10, 201) with improved pick evaluation is provided. The apparatus (10, 201) includes a placement head (206) having at least one nozzle (208, 210, 212) for releasably picking up and holding a component (304) . A robotic system is provided for generating relative movement between the placement head (206) and a workpiece (203) , such as a circuit board. An image acquisition system (300) is disposed to obtain at least one before -pick image of a component pick up location (16) and at least one after-pick image of the component pick up location (16) . The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.