发明名称 METHOD FOR PROCESSING METAL MEMBER AND APPARATUS FOR PROCESSING METAL MEMBER
摘要 <p>Before bonding electrodes together, oxide films on the electrode surfaces are removed without using hydrochloric acid. Two chips respectively provided with an electrode are carried into a processing chamber, and respectively sucked onto an upper chuck and a lower chuck. Then, a nitrogen gas is introduced into the processing chamber, thereby creating a low oxygen atmosphere. After that, a hydrogen gas and a nitrogen gas are introduced into the processing chamber and each electrode is heated in the mixed gas atmosphere. Consequently, the oxide film on the surface of each electrode is reduced with hydrogen, and thus the oxide film is removed from the electrode surface.</p>
申请公布号 WO2007013445(A1) 申请公布日期 2007.02.01
申请号 WO2006JP314653 申请日期 2006.07.25
申请人 TOKYO ELECTRON LIMITED;OCTEC INC.;FURUYA, KUNIHIRO;KUMAGAI, YASUNORI;OKUMURA, KATSUYA 发明人 FURUYA, KUNIHIRO;KUMAGAI, YASUNORI;OKUMURA, KATSUYA
分类号 H01L21/60;B23K20/24;C23G5/00 主分类号 H01L21/60
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