发明名称 |
FABRICATION PROCESS OF THERMALLY CURABLE THICK-FILM RESISTOR AND RESISTOR MADE BY THE PROCESS |
摘要 |
A method of fabricating a thermoset thick film resistor and a resistor manufactured by the same are provided to form a resistor in a uniform shape and prevent overlap between the resistor and a metal pad. A metal material is deposited on a substrate(1), and then is partially etched to form a lower metal pad(4). A thick resistor paste is applied to cover the lower metal pad, and is dried or annealed to form a resistor(5). An insulating material is applied on the substrate, in which the resistor is not formed, to form an insulating layer(6). After the metal material is deposited on the resistor and the insulating layer, both sides of the metal material are etched to form an upper metal pad(7).
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申请公布号 |
KR20070014617(A) |
申请公布日期 |
2007.02.01 |
申请号 |
KR20050069420 |
申请日期 |
2005.07.29 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
YOO, MYONG JAE;PARK, SEONG DAE;KANG, NAM KEE;PARK, JONG CHUL |
分类号 |
H01C17/065;H01C17/075 |
主分类号 |
H01C17/065 |
代理机构 |
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代理人 |
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地址 |
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