发明名称 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To smoothly perform resin molding of high quality without forming a projection or the like on the outer surface of a resin molding part and producing resin flash on the surface of a product to be molded. SOLUTION: A resin molding mold is equipped with a cavity block 14, which is formed according to the arrangement of a cavity for molding the product 30 to be molded using a resin, and a clamper 16 which is provided so as to surround the cavity block 14 and supported in a state that its inside surface is brought into slide contact with the side surface of the cavity block 14 in a manner movable in a mold opening and closing direction and forms a cavity recessed part having the edge face of the cavity block as an inner bottom face. An air suction hole 16c, which communicates with the cavity recessed part and sucks a release film 10 to the cavity recessed part, is provided to the inside surface being brought into slide contact with the side surface of the cavity block 14 and arranged so as to be closed when the cavity block 14 is moved to a mold clamping position. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007021725(A) 申请公布日期 2007.02.01
申请号 JP20050202440 申请日期 2005.07.12
申请人 APIC YAMADA CORP 发明人 KOBAYASHI KAZUHIKO;MIYAJIMA FUMIO;KOBAYASHI KAZUHIKO;GOTO NAOYA
分类号 B29C43/36;B29C33/18;B29C43/18;B29C43/34;B29C43/56 主分类号 B29C43/36
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