| 摘要 |
A chip package ( 200 ) includes a carrier ( 20 ), a chip ( 22 ), a second conductive means ( 26 ) and a transparent cover ( 28 ). The carrier ( 20 ) includes a base ( 24 ). The chip is mounted on the base and has an active area ( 222 ). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space ( 32 ) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
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