| 摘要 |
A laser marking apparatus for a semiconductor package is provided to improve productivity by performing simultaneously a transferring process and a marking process on the semiconductor package using a transfer unit and a fixing unit. A laser marking apparatus includes a loading unit for supplying a semiconductor package to a transfer table(2), a transfer unit(4) for transferring the semiconductor package along the transfer table, a fixing unit(5) for fixing the semiconductor package, a laser marking unit(6) for marking on the semiconductor package, and a contaminant removing unit for absorbing predetermined resin particles. The transfer unit includes a first fixing pin for fixing the semiconductor package under a semiconductor package transfer process. The fixing unit includes a second fixing pin(52) for fixing the semiconductor package under a semiconductor package marking process.
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