| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging structure capable of reducing, even when a terminal electrode of a minute size electronic component and an electrode land on a circuit board are connected therebetween, connection resistance thereof and a variation of the same. <P>SOLUTION: The structure comprises an electronic component 10 having the terminal electrode 10a; the circuit board 12 having an electrode land 12a formed at a position corresponding to the terminal electrode 10a; and a conductive adhesive 14 for electrically and mechanically connecting the terminal electrode 10a and the electrode land 12a. The conductive adhesive 14 contains as chief ingredients thermosetting resin 18 and conductive particles. The conductive particles are a mixture of at least large diameter particles 16a and small diameter particles 16b or a mixture of the large diameter particles 16a, the small diameter particles 16b, and flake-shaped conductive particles. The content of the large diameter particles 16a having the maximum diameter among spherical conductive particles 16 is most increased, and a connection interval t between the terminal electrode 10a and the electrode land 12a is made the same as the size of the large diameter particle 16a of the conductive adhesive 14. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
