发明名称 COOLING SYSTEM AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling system which cools a heating component by circulating a cooling liquid by a fluid pump, wherein the fluid pump need not be located separately from a heat receiving portion and thereby space can be saved, and even if the fluid pump gets out of order, the heating component can be kept cooled. <P>SOLUTION: A casing cover 16 of a casing 10 of the built-in motor fluid pump 8 is formed of a good thermal conductor such as aluminum. The casing cover 16 is in contact with the heating component 5, and the heating component 5 is cooled by the cooling liquid flowing inside the casing 10. Even if either one of the plurality of fluid pumps 8 gets out of order, the cooling liquid sent out from the other fluid pumps 8 rotates the impeller 12 of the faulty fluid pump 8, so the faulty fluid pump 8 cools the heating component 5 nearly normally, too. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007027257(A) 申请公布日期 2007.02.01
申请号 JP20050204356 申请日期 2005.07.13
申请人 TOSHIBA CORP 发明人 ITO KENICHI
分类号 H05K7/20;F04D13/06;F04D13/14;G06F1/20;H01L23/473;H02K7/11;H02K7/14;H02K21/24;H02K29/00;H02K49/10 主分类号 H05K7/20
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