发明名称 CHIP TYPE FUSE DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To increase the resistance of a fuse element and to facilitate the control of a resistance value of the fuse element, in a chip type fuse device with a fuse element formed by using a low-cost printing method. SOLUTION: This chip type fuse device is provided, on a board, with the fuse element formed by a printing method. The fuse element includes a metal area and a metal oxide area and the metal area and the metal oxide area are formed of the same kind of metal. A surface part of a metal layer is oxidized and a metal oxide layer is formed on the surface thereof. An extraction electrode is connected to the metal layer. The metal included in the fuse element is preferably easily oxidized as compared with the metal included in the extraction electrode. The metal included in the fuse element is at least one kind selected from, for instance, Cu and Ni. The metal included in the extraction electrode is at least one kind selected from, for instance, Ag, Au, Pt, Pd, Rh, Ru and Ir. After the metal oxide layer is formed as the metal oxide area by sintering the metal oxide, the metal area may be formed by reducing a part thereof. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007027077(A) 申请公布日期 2007.02.01
申请号 JP20050250210 申请日期 2005.08.30
申请人 TDK CORP 发明人 IGARASHI KATSUHIKO;TSUNODA HIROIKU
分类号 H01H85/046;H01H69/02;H01H85/045;H01H85/06 主分类号 H01H85/046
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