发明名称 Substrate processing system
摘要 A substrate processing system is provided, which efficiently utilizes reactive substances or carrier gases necessary for the surface processing of a substrate, simplifies equipment for the gas transfer and effects energy saving. This system comprises a gas supply source 12 for supplying a process gas containing a reactive substance, a reservoir tank 14 connected to the gas supply source 12 for reserving the process gas, a reactor 10 for exposing a substrate placed therein to the process gas, a first circulation pipe 38 for introducing the process gas inside the reactor 10 into the reservoir tank 14 , a second circulation pipe 42 for introducing at least part of the process gas in the reservoir tank 14 into the reactor 10 , and a flow regulating valve 44 disposed in the second circulation pipe 42 for regulating the amount of process gas to be introduced into the reactor 10.
申请公布号 US2007026150(A1) 申请公布日期 2007.02.01
申请号 US20050559669 申请日期 2005.12.06
申请人 HORIUCHI TAKAO;HORIUCHI AZUMI;OGAMINO HIROAKI;NIIMURA YASUHIRO;HATTORI HIROSHI 发明人 HORIUCHI TAKAO;HORIUCHI AZUMI;OGAMINO HIROAKI;NIIMURA YASUHIRO;HATTORI HIROSHI
分类号 C23C16/00;C23C16/44;C23C16/455;C30B25/02;H01L21/00;H01L21/302 主分类号 C23C16/00
代理机构 代理人
主权项
地址