发明名称 |
A PACKAGE FOR A DIE |
摘要 |
A package for a die comprising a thermally conducting carrier; a dielectric frame on the carrier, the frame having a recess therein for receiving a die; an electrically insulating lid adapted to be positioned on the frame to cover the recess, the lid having dimensions such that when covering the recess a portion of the lid extends beyond the frame creating at least one overhang; the frame having at least one electrically conducting frame path; and the lid having a corresponding electrically conducting lid path arranged such that when the lid is positioned on the frame a portion of the lid path overlies the frame path, the lid path extending onto the overhang beyond the frame. |
申请公布号 |
WO2007012833(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
WO2006GB02761 |
申请日期 |
2006.07.24 |
申请人 |
FILTRONIC PLC;GILMARTIN, EAMONN;DAVID, STEPHANE |
发明人 |
GILMARTIN, EAMONN;DAVID, STEPHANE |
分类号 |
H01L23/051;H01L23/04;H01L23/13;H05K1/18 |
主分类号 |
H01L23/051 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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