| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a capability of a performance deterioration of a semiconductor manufacturing device or a semiconductor inspecting device which deals with a wafer conveyed from an exposure device while preventing a yield from lowering, to simplify a structure of the exposure device, to improve a throughput, or to miniaturize the exposure device. <P>SOLUTION: In the semiconductor exposure device there are provided means for eliminating liquid adhering to a front surface and a rear face of the wafer and means for expediting evaporation. The means for eliminating the liquid on the wafer rear face and means for expediting the evaporation are to suck liquid drops on the wafer with a toroidal porous material, or to spray a dry gas in a circle or a combination of sucking and spraying, or to suck liquid turning to the wafer rear face with the porous material after performing a liquid cutting on the wafer front surface with an air knife. <P>COPYRIGHT: (C)2007,JPO&INPIT |
