| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate whose warping due to, for example, heat applied in a manufacturing process is minimized by providing a substrate whose deformation due to heat can be minimized. <P>SOLUTION: A flip chip BGA substrate 10 has a polygonal shape by uniformly removing corner parts. The flip chip BGA substrate 10 may have a hexagonal shape. In the flip chip BGA substrate, the corner parts may be rounding-processed while having the same curvature radius. Further, the flip chip BGA substrate may has a circular shape. <P>COPYRIGHT: (C)2007,JPO&INPIT |
