| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which bonding reliability between a conductive layer and a resin layer and adhesion can be improved, high density of wiring patterns can be also achieved, and no hazardous substance is needed for manufacture; and to provide a wiring board. <P>SOLUTION: An ultraviolet light UV is directed to a resin layer 12 containing photocatalyst particles 16 through a mask 26 to expose the photocatalyst particles 16 over the surface of the resin layer 12. Since the photocatalyst is used to form a wiring pattern, high density of the wiring patterns can be achieved. While the resin layer 12 is being impregnated with a liquid 30, the ultraviolet light UV is given to it, so that the precipitated copper film 20 is used as a power supply layer and electroplating is applied onto the resin layer 12 to form a conductive layer 14. The surface of the resin layer 12 is made uneven due to the photocatalyst 16 exposed from the resin layer, and the conductive layer 14 is deformed and adhered to the surface in a manner to absorb irregularities. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
