| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a stacked electronic component capable of shortening time for a stacking process and using a thinned internal structure as a continuously stacking method, and to provide its device. SOLUTION: The manufacturing device of the stacked electronic component is provided with a sheet feeder for supplying green sheets 8, an adhesive applier 3 for applying an adhesive to the green sheets 8, a rotary drum 4 for mounting and stacking the green sheets 8, an adhesive transfer for transferring the adhesive onto the green sheet 8 on the surface of the rotary drum 4, an unwinding roll 16 for feeding the internal structure 15 formed on a conveyance film 19, a detecting and recognizing mechanism 14 for detecting and recognizing the transferred internal structure 15, and a drying mechanism 13 for drying the transferred internal structure 15. The adhesive is transferred with the green sheet 8 on the surface of the rotary drum 4 patterned, and the internal structure 15 on the surface of the conveyance film 19 is similarly separated (exfoliated) and transferred for continuously stacking. COPYRIGHT: (C)2007,JPO&INPIT
|
