BONDING PAD FABRICATION METHOD, METHOD FOR FABRICATING A BONDING PAD AND AN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

A method for fabricating a bonding pad 45 includes disposing a droplet L including a liquid containing a conductive material on a substrate P by a droplet ejection method and solidifying the disposed droplet L to forms the pad. The bonding pad 45 formed has a cylindrical shape and includes a concave part 47.