COPPER FINE PARTICLE DISPERSION LIQUID AND METHOD FOR PRODUCING SAME

摘要

Disclosed is a copper fine particle dispersion liquid containing copper fine particles having a particle size of not more than 100 nm and suitable as wiring material. This copper fine particle dispersion liquid is excellent in dispersibility and oxidation resistance, and enables to form a conductive film having excellent conductive characteristics and film formability by low-temperature firing. Specifically disclosed is a copper fine particle dispersion liquid composed of copper fine particles coated with a water-soluble polymer and a hydroxycarboxylic acid, a hydroxycarboxylic acid, and a polyhydric alcohol and/or a polar solvent. The copper fine particle dispersion liquid is produced as follows: a dispersion liquid obtained by dispersing copper fine particles, which are coated with a water-soluble polymer, in a polar solvent is added with a hydroxycarboxylic acid such as malic acid or citric acid or a solution thereof and stirred, thereby substituting a part of the water-soluble polymer with the hydroxycarboxylic acid; then the free water-soluble polymers are discharged by ultrafiltration; and then a hydroxycarboxylic acid and a polyhydric alcohol and/or a polar solvent are added thereinto.