发明名称 |
PROCESS FOR PRODUCING WIRING BOARD COVERED WITH THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM |
摘要 |
<p>This invention provides a production process that can provide a wiring board having the same quality at a high yield in the production of a wiring board by stacking, by hot pressing, a thermoplastic liquid crystal polymer which is an excellent wiring board covering material, onto a wiring substrate. The production process comprises stacking a thermoplastic liquid crystal polymer film onto a wiring substrate with one layer including an electrically conductive circuit being exposed thereon, and hot pressing the assembly to produce a wiring board and is characterized by comprising measuring the viscoelasticity of a thermoplastic liquid crystal polymer of the film at a low frequency in a stacking temperature region, selecting a temperature at which the property value falls within a predetermined range, and conducting hot pressing at the temperature.</p> |
申请公布号 |
WO2007013330(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
WO2006JP314242 |
申请日期 |
2006.07.19 |
申请人 |
KURARAY CO., LTD.;ONODERA, MINORU;YOSHIKAWA, TADAO |
发明人 |
ONODERA, MINORU;YOSHIKAWA, TADAO |
分类号 |
H05K3/28;B32B7/02 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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