发明名称 |
LED PACKAGE HAVING DUAL LENS STRUCTURE OF LATERAL LIGHT EMISSION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package having a dual lens structure for lateral light emission. <P>SOLUTION: The LED package comprises: an LED chip; a lower structure including a pair of electric connection portions for supplying power to the LED chip, a package body that secures or holds the electric connection portions and has a recess for upwardly guiding light emitted from the LED chip, and a transparent sealant having a flat top surface with which the recess of the package body is filled to seal the LED chip; a lower lens having an upper hemispherical shape which is secured to an upper portion of the lower structure so as to be attached to the top surface of the transparent sealant; and, as a funnel-shaped member secured to the upper end of the lower lens, an upper lens that includes an axially symmetrical reflecting surface for laterally reflecting light emitted from the LED chip and passing through the lower lens and an emitting surface for laterally and outwardly emitting light reflected by the reflecting surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007027765(A) |
申请公布日期 |
2007.02.01 |
申请号 |
JP20060197321 |
申请日期 |
2006.07.19 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
HAN KYUNG TAEG;CHOI MYOUNG SOO;LEE SEON GOO;HAN SEONG YEON;HAHM HUN JOO;SONG CHANG HO |
分类号 |
H01L33/56;H01L33/58;H01L33/62 |
主分类号 |
H01L33/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|