| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist coating device which makes it possible to recycle solvent for cleaning a rear face of a substrate, and to provide a method of cleaning the rear face of the substrate. <P>SOLUTION: A method of dribbling a resist on a front surface of a wafer W and of eliminating the resist turning to a rear face from a front surface of the wafer W at the time of coating the resist on the front surface of the wafer W rotates this wafer W to diffuse the resist by a centrifugal force. The method comprises the steps of supplying solvent obtained by blending acetic acid and carbonic acid ethylene to the rear face of the wafer W, collecting the supplied solvent from the rear face of the wafer W, and dissolving ozone in the collected solvent. With such a configuration, since the resist in the solvent is dissolved by the ozone, a recycling of the solvent is possible. <P>COPYRIGHT: (C)2007,JPO&INPIT |
