| 摘要 |
PROBLEM TO BE SOLVED: To provide a PGA-type wiring board for preventing the posture of a pin from changing easily even through the packaging process of an integrated circuit chip. SOLUTION: In the wiring board, solder paste 13p is printed on a back terminal pad 111 in a substrate body 101. A spherical pin 121 is set to a pin erection jig 141. The pin erection jig 141 and a substrate body 101 are positioned relatively. The pin erection jig 141 and the substrate body 101 are heated, and the spherical pin 121 set to the pin erection jig 141 is soldered to the back terminal pad 111 in the substrate body 101. A soldering reflow process is made while applying a load to the substrate body 101 from a front side so that a collar section 123 of the spherical pin 121 and the back terminal pad 111 approach relatively according to heating. COPYRIGHT: (C)2007,JPO&INPIT
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