| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive fine particles capable of improving reliability of connection when electrodes of a semiconductor element and a circuit board are connected to each other and maintaining a low contact resistance to the electrodes, and to provide an adhesive using the same. SOLUTION: The conductive fine particles 4 each comprise a metallic fine particle 8, and a metallic layer 9 formed on the surface of the metallic fine particle 8 and having a melting point of 350°C or lower. Accordingly, adhesiveness of the metallic fine particle 8 and the metallic layer 9 formed on the surface thereof to each other is improved, and furthermore, pressure resistance and heat resistance are also improved. Consequently, it is possible to effectively prevent peeling-off of the metallic layer 9 formed on the surface of the metallic fine particle 8, and therefore the reliability of connection between electrodes 6 and 7 is improved and the contact resistance of the conductive fine particles 4 to the electrodes 6 and 7 is kept low. COPYRIGHT: (C)2007,JPO&INPIT
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