发明名称 BINDERLESS BOARD
摘要 PROBLEM TO BE SOLVED: To provide a binderless board which has a mechanical strength equivalent to that of a plywood, is free from the need for heating at a high temperature, does not cause odor and discoloration problem and is easy to recycle. SOLUTION: The binderless board comprises the plant pieces 1 composed of stems of herbage containing hemicellulose, wherein the stems run parallel with each other without being disintegrated into chips or fibers and the plant pieces have been bonded to each other with an adhesive component contained in the plant piece by heating and presuure-molding them in the presence of moisture. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007021972(A) 申请公布日期 2007.02.01
申请号 JP20050209602 申请日期 2005.07.20
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUGAWARA AKIRA
分类号 B27N3/04 主分类号 B27N3/04
代理机构 代理人
主权项
地址