| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that a damage of a resin package may be derived from the difficulty in extraction since the contact area is large between a resin package and a mold in the conventional manufacturing method of resin-packaged optical electronic components, and that also it has become difficult to attach a shielding case due to the miniaturization of a resin package. <P>SOLUTION: A resin-packaged optical electronic component A comprising a resin package 3 with a lens 5 formed therein is constituted by covering a suitable part with a shielding material 2 other than the lens 5 on the surface of this resin package 3. In its manufacturing method; the shielding material 2 is set in the inside of a mold 1 opened upward having a lens formation 4 at the bottom, resin in a flow state is poured into the inside of the mold 1 wherein the shielding material 2 is set, and it is extracted from the mold after making this resin package 3 and the shielding material 2 unify, while making it harden and forming the resin package 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
