| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for light-emitting element packaging featuring good heat dissipation and excellent extensibility capable of mounting many light emitting elements using only interconnect lines in the substrate, and of easily connecting with other substrates; and to provide luminescent module composed of the substrate with light-emitting elements mounted, and lighting apparatus. <P>SOLUTION: On the outside of an enamel substrate where an enamel layer is coated on the surface of core metal, conductive layers with multiple layers and insulating layers between the conductive layers are formed. Then, the conductive layers arranged on the side of the foregoing enamel layer are arranged from one end to the other end of the enamel substrate with continuous connection, and those layers supply power to multiple light-emitting elements mounted along the longitudinal direction of the conductive layer, and form the connecting part with other substrates after the conductive layer is extended on the surface of projections arranged on the both ends of the enamel substrate. In addition, the luminescent module is also provided as composed of the substrate with light emitting elements mounted. <P>COPYRIGHT: (C)2007,JPO&INPIT |
