| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC medium formed by interposing an inlet constituted by electrically connecting an IC chip and an antenna between front and back base materials through adhesive, wherein when the IC inlet in the non-contact IC medium with paper as the base materials is intentionally peeled, the antenna can be surely broken down. <P>SOLUTION: This non-contact IC medium is formed by interposing a non-contact IC inlet constituted of an IC chip in which unique identification information is stored and an antenna where the section of an antenna by the printing whose film thickness is 1 to 30μm and the section of an antenna by etching are connected for transmitting and receiving the identification information between base materials equipped with adhesive layers. The strength of the section of the antenna by printing is made fragile than the section of the antenna by etching so that when the base materials are peeled, the antenna section by printing of the antenna joined to the IC chip bonded between the base materials can be broken down. <P>COPYRIGHT: (C)2007,JPO&INPIT |
