PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing generation of bubbles in a developer during development and capable of forming a resist having excellent adhesion to a conductor layer as well as excellent resolution.

SOLUTION: The photosensitive resin composition contains a binder polymer, a photopolymerizable compound having a polymerizable ethylenically unsaturated group represented by formula (1), and a photopolymerization initiator, wherein R11is H or methyl; R12is alkyl or cycloalkyl; R13and R14are each alkylene but denote groups different from each other; and p and q are each independently an integer of 1-15.

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