| 摘要 |
PROBLEM TO BE SOLVED: To provide a device incorporating components capable of arranging a via to easily penetrate both sides of a semiconductor IC chip in a dry process and incorporating even an electronic component other than a semiconductor, and to provide its manufacturing method. SOLUTION: The method is the one for manufacturing an electronic device where component chips 101 are embedded inside a substrate 103 made of an insulation resin and which is the device incorporating the components. A first through-hole 102 penetrating the both sides of the component chip 101 is arranged at least in one component chip 101; a second through-hole 104 penetrating the both sides of the substrate 103 passes through the first through-hole 102, and is arranged at a position not to contact the inner surface of the first through-hole 102 in the substrate 103; and electric circuit conductive bodies 106, 107 arranged on the both sides of the substrate 103 are conductively connected by a conductive body 108 which is disposed in the second through-hole 104. COPYRIGHT: (C)2007,JPO&INPIT |
