| 发明名称 |
MULTILAYERED CIRCUIT BOARD AND ITS MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayered circuit board and its manufacturing method wherein high frequency transmission characteristics of a transmission line are improved together with an improvement of the flexibility of a design. <P>SOLUTION: The multilayered circuit board excellent in high speed data transmission characteristics is provided by including: a first substrate 10a having a pair of first earth electrodes 14a provided in parallel at the left and right of a signal electrode 13 and its signal electrode 13; a second substrate 10b having a pair of second earth electrodes 14b provided at a position facing a first earth electrode 14a; a conductor 15 provided between the first substrate 10a and the second substrate 10b for connecting between the first earth electrode 14a of the first substrate 10a and the second earth electrode 14b of the second substrate 10b; and a space part 12 provided by the conductor 15 around at least the signal electrode 13. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
| 申请公布号 |
JP2007027172(A) |
申请公布日期 |
2007.02.01 |
| 申请号 |
JP20050202733 |
申请日期 |
2005.07.12 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
UEDA YOJI;SAKURAI DAISUKE;OCHI SHOZO;TSUKAHARA NORITO |
| 分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
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