| 摘要 |
PROBLEM TO BE SOLVED: To improve the conductivity by enhancing the adhesiveness of the conductor of a conduction between layers and the conductive layers of a conductive counterpart between layers, and to reduce the connection resistance of the circuit between layers. SOLUTION: The structure of conduction between layers is provided in an insulating layer 11 and electrically connetcts mutually the conductive layers 12, 22 located at the both side of an insulating layer 11. The interface is formed to be like rough spherical surface between the conductors (sintered conductive paste 15) which the conductive portion between layers has, and the conductive layer 22. COPYRIGHT: (C)2007,JPO&INPIT |
