发明名称 Data processing method in semiconductor device, program of the same, and manufacturing method of semiconductor device
摘要 A design data processing method in a semiconductor device includes extracting, from design data, a graphic in which there exist a first wiring and a second wiring which is orthogonal to the first wiring, and changing a portion where the first wiring is orthogonal to the second wiring to make connection at an angle other than 90 degrees, thereby preparing new design data.
申请公布号 US2007028205(A1) 申请公布日期 2007.02.01
申请号 US20060492802 申请日期 2006.07.26
申请人 NAKANO AYAKO;KOTANI TOSHIYA;WATANABE ATSUSHI 发明人 NAKANO AYAKO;KOTANI TOSHIYA;WATANABE ATSUSHI
分类号 G06F17/50;G03F1/36;G03F1/68;G03F1/70;H01L21/027;H01L21/3205;H01L21/768;H01L21/82;H01L23/522 主分类号 G06F17/50
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