Semiconductor arrangement production involves initially providing support substrate and function region

摘要

The production of a semiconductor chip arrangement involves initially preparing a supporting substrate (1) followed by a function region (3') and then forming a silicon-germanium-containing or silicon-germanium adhesive layer on first and second joining surfaces (O; O'), and these surfaces are then joined via the adhesive layer. The joined semiconductor chips are separated along a partition zone and remain joined to the support substrate via the adhesive layer, which is then removed by etching selectively relative to the semiconductor chips (C1'-C3'). An independent claim is included for a semiconductor chip arrangement.