| 摘要 |
<p>An epoxy resin composition for semiconductor sealing containing as indispensable components (A) phenol aralkyl epoxy resin having a phenylene skeleton, (B) phenol aralkyl resin having a biphenylene skeleton, (C) hardening accelerator containing an adduct of phosphine compound and quinone compound, (D) compound having two or more adjacent carbon atoms as constituents of an aromatic ring to which hydroxyls are linked respectively, (E) silane coupling agent and (F) inorganic filler, characterized in that the inorganic filler (F) is contained in an amount of 84 to 92 wt.% based on the total weight of the epoxy resin composition.</p> |
