| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity for an IC chip packaging method for packaging a plurality of IC chips on a base. <P>SOLUTION: A surface at a side opposite to a mount surface on the base is mounted by a tape, the tape is allowed to leave by dicing, and a wafer separated for each IC chip is prepared. The wafer is allowed to oppose the base in a direction where the mount surface on the base opposes the base. The base is fed in a prescribed one-dimensional direction along the wafer, the wafer is moved two-dimensionally along the base, IC chips on the wafer are pressed onto the base successively and are tentatively fixed on the base, and the plurality of IC chips tentatively fixed on the base are heated and pressurized collectively, thus fixing the plurality of IC chips on the base. <P>COPYRIGHT: (C)2007,JPO&INPIT |
